JPH0337235Y2 - - Google Patents
Info
- Publication number
- JPH0337235Y2 JPH0337235Y2 JP1984182641U JP18264184U JPH0337235Y2 JP H0337235 Y2 JPH0337235 Y2 JP H0337235Y2 JP 1984182641 U JP1984182641 U JP 1984182641U JP 18264184 U JP18264184 U JP 18264184U JP H0337235 Y2 JPH0337235 Y2 JP H0337235Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- case
- internal casting
- casting resin
- sealed package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984182641U JPH0337235Y2 (en]) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984182641U JPH0337235Y2 (en]) | 1984-11-30 | 1984-11-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6197847U JPS6197847U (en]) | 1986-06-23 |
JPH0337235Y2 true JPH0337235Y2 (en]) | 1991-08-07 |
Family
ID=30740176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984182641U Expired JPH0337235Y2 (en]) | 1984-11-30 | 1984-11-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0337235Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7431085B2 (ja) * | 2020-03-31 | 2024-02-14 | ニデックインスツルメンツ株式会社 | アクチュエータおよびダンパーユニット |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS585348U (ja) * | 1981-07-02 | 1983-01-13 | 日本電気株式会社 | 樹脂封止型半導体装置 |
-
1984
- 1984-11-30 JP JP1984182641U patent/JPH0337235Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6197847U (en]) | 1986-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4855868A (en) | Preformed packaging arrangement for energy dissipating devices | |
JPH02222565A (ja) | 半導体装置 | |
JPH043450A (ja) | 樹脂封止型半導体装置 | |
JPH0337235Y2 (en]) | ||
JPS5824464Y2 (ja) | 混成集積回路装置 | |
JP2548625B2 (ja) | 半導体装置の製造方法 | |
JPS62104145A (ja) | 半導体装置 | |
JPH0548955B2 (en]) | ||
JPS60157241A (ja) | 半導体装置 | |
JP2836219B2 (ja) | 樹脂封止型半導体パッケージ | |
JPS61102040A (ja) | 樹脂封止型半導体装置の製造方法 | |
JPS58121652A (ja) | 混成集積回路装置 | |
JPH08130291A (ja) | 半導体装置 | |
JPH0432758Y2 (en]) | ||
JPH0526760Y2 (en]) | ||
JPS62113433A (ja) | 樹脂封止形半導体装置の製造方法 | |
JPH0236281Y2 (en]) | ||
JPS60254643A (ja) | 樹脂封止型半導体装置 | |
JPH02298051A (ja) | 半導体装置 | |
JPH0464255A (ja) | 半導体装置 | |
JPH0412681Y2 (en]) | ||
JPS6314466Y2 (en]) | ||
JPH0237752A (ja) | 半導体装置 | |
KR20010061847A (ko) | 열방출형 반도체 패키지 및 이 패키지가 실장된 메모리 모듈 | |
KR200289924Y1 (ko) | 리드프레임 |